ETA Dynaform 7.2 Build 2024.10.01 Win x64 Multilanguage

What's new in Dynaform 7.2
Building on the robust capabilities of its predecessor, Dynaform 7.2 introduces a range of new features and enhancements designed to further streamline and optimise the simulation of die system processes in the automotive, aerospace, and manufacturing sectors. ETA has released a new tool, marking a significant advancement in its commitment to providing advanced tools to engineers and manufacturers worldwide.
Dynaform 7.2 improves the speed and precision of metal-forming processes by introducing new features, including advanced die face design and formability simulation capabilities, which were groundbreaking in their own right. Notable improvements include in Blank Size Engineering (BSE), Die Face Design (DFD), Formability Simulation (FS), and Tube Bending & Forming (TBF). The BSE module now offers better nesting results, providing users with higher material utilisation rates. The DFD module enhances tool design flexibility with Auto CAM and Trim Segment functionalities, enhancing multistage design and cutting operations.
ETA's Sigform solver continues to be at the core of accurate and rapid multistage forming simulations, now further enhanced to deliver even more precise results under complex forming conditions. Moreover, the Die Structural Integrity (DSI) module dynamically analyzes die structures, providing detailed insights into mechanical performance, load-bearing capacity, and potential stress areas.

- Building on its predecessor, Dynaform 7.2 introduces several critical new features, making it the most comprehensive sheet metal forming solution to date. Here are the key highlights:
- Sigform Solver Enhancements: Dynaform 7.2's Sigform provides even greater accuracy and efficiency in sheet metal forming simulations, supported by parallel frameworks that enable faster processing.
- Die Face Design: A series of new tools such as the Auto CAM, Trim Segment, and Flange Tool Enhancements make multistage die face design easier and more intuitive. Users can now perform operations like trimming, flange modification, and addendum creation with increased flexibility.
- Clamping Springback in FS: This feature allows for the measurement of springback using pads, pilot pins, and clamps, enabling sequential closing for improved simulation accuracy.
- Hot Forming in FS: With the growing application of high-strength steel, Dynaform 7.2 introduces a user-friendly interface for complex hot forming setups, simulating various stages from gravity and forming to cooling and hardening.
- Sheet Drop Test: Dynaform 7.2's Drop Test module simulates part deformations during production, analysing issues like panel deformations from drops, thus ensuring dimensional accuracy in automotive components.
- Die Structural Integrity (DSI): This module provides a comprehensive solution for die system analysis, offering insights into nonlinear, dynamic problems commonly encountered in mechanical and structural engineering.

Dynaformis a sheet metal forming simulation tool designed to improve all phases of the die development process. It allows an organization to entirely bypass soft tooling, reducing overall try-out time, lowering costs, increasing productivity and providing complete confidence in die system design. It also allows evaluation of alternative and unconventional designs and materials for an optimal solution.
Dynaform 7.2is a revolutionary solution for sheet metal forming, offering efficiency, reduced production time, and increased profitability in automotive, aerospace, and other industrial applications, redefining productivity and performance standards.
Dynaform
Engineering Technology Associates, Inc.provides computer aided engineering services. The Company designs and develops numerous products such as autos, trains, aircraft, household appliances, and consumer electronics. ETA was founded in 1983 and within three years was established as a tier-one supplier to Ford, GM, and Chrysler, in addition to providing engineering services to OEMs and suppliers in US and Asia.