Cadence Design Systems Analysis Sigrity 2024.1 HF001 (24.10.001) Win x64

Sigrity and Systems Analysis (SIGRITY/SYSANLS) 2024.1 Release - Date: October 2024


Systems Analysis 2024.1

Clarity 3D Solver
- Clarity 3D Layout Structure Optimization Workflow: A new workflow, Clarity 3D Layout Structure Optimization Workflow, has been added to Clarity 3D Layout. This workflow integrates Allegro PCB Designer with Clarity 3D Layout for high-speed structure optimization.
- Component Geometry Model Editor: The new Clarity 3D Layout editor lets you set up ports, solder bumps/balls/extrusions, and two-terminal and multi-terminal circuits using a single GUI.
- Coaxial Open Port Option Added to Port Setup Wizard: The Coaxial Open Port option lets you create ports for each target net pin and reference net pin in Clarity 3D Layout. The nearby reference net pins are then used as a reference for each target net pin, reducing the number of ports needed. In addition, the ports of unused reference net pins are shorted to the ground.
- Parametric Import Option Added: Two new options, Parametric Import and Default Import, have been added to the Tools - Launch Clarity3DWorkbench menu. The Parametric Import option lets you import the design along with its parameters into Clarity 3D Workbench. The Default Import option lets you ignore the parameters when importing the design into Clarity 3D Workbench.
- Component Library Added to Generate 3D Components: Clarity 3D Workbench now includes a new component library that lets you use predefined 3D component templates or add existing 3D components to create 3D designs and simulation models.
- AI-Powered Content Search Capability: Clarity 3D Workbench and Clarity 3D Transient Solver now support an AI-powered capability for searching the content and displaying relevant information.
- Expression Parser to Handle Undefined Parameters: Clarity 3D Workbench and Clarity 3D Transient Solver support writing expressions or equations containing undefined parameters in the Property window to describe a simulation variable. The improved expression parser automatically detects any undefined parameter in an expression and prompts users to specify their values. This capability lets you define a model or a simulation variable as a function instead of specifying static values.
Clarity 3D Transient Solver
- Mesh Processing Improved to Simulate Large Use Cases: Clarity 3D Transient Solver leverages a new meshing algorithm that enhances overall mesh processing, specifically for large designs and use cases. The new algorithm dramatically improves the mesh quality, minimum mesh size, number of mesh key points, total mesh number, and memory usage.
- Advanced Material Processing Engine: The material processing capability has been enhanced to handle thin outer metal, which previously resulted in open and short issues in some designs. In addition, the material processing engine offers improved mode extraction for particular use cases, including waveguide and coaxial designs.
- Characteristic Impedance Calculation Improved: The solver engine now uses a new analytical calculation method to calculate the characteristic impedance of coaxial designs with improved accuracy.
Celsius Studio
- Celsius Interchange Model Introduced: Celsius Studio now supports Celsius Interchange Model generation, which is a 3D model derived from detailed physical designs for multi-physics and multi-scale analysis. This Celsius Interchange Model file (.cim) serves as a design information carrier across Celsius Studio tools, enabling a variety of simulation and analysis tasks.
- Celsius 3DIC Thermal Workflow Improvements: The Thermal Simulation workflows in Celsius 3DIC have been significantly enhanced. Key improvements include:
. Advanced Power Setup with Transient Power Function and Multi Mode options
. Enhanced GUI for the Mesh Control and Simulation Control tabs
. Improved meshing capabilities
. Celsius Interchange Model (.cim) generation
. Material library support for block and connections
. Import of Heat Transfer Coefficients (HTCs) from a CFD file
. Bump creation through the Bump Array Wizard
. Layer Stackup CSV file generation
- Celsius 3DIC Warpage and Stress Workflow Enhancements: The Warpage and Stress workflow in Celsius 3DIC has undergone significant improvements, such as:
. Improved multi-stage warpage simulation flow for 3DIC packaging process
. Enhanced GUI for the Mesh Control, Simulation Control, and Stress Boundary Conditions tabs
. Support for large deformations and temperature profiles
. Bump creation through the Bump Array Wizard
. New constraint types
. Enhanced meshing capabilities
- Geometric Nonlinearity Support in Warpage and Stress Analysis: Large deformation analysis is now supported in warpage and stress studies. This study uses the Total Lagrangian approach to model geometric nonlinearities in simulation, which allows accurate prediction of final deformations.
- Thermal Network Extraction and Simulation: In the solid extraction flow in Celsius 3D Workbench, you can now import area-based power map files to create terminals. For designs with multiple blocks, this capability allows automatic terminal creation, eliminating the need to manually create and set up 2D sheets individually. Additionally, thermal throttling feature is now supported in Celsius Thermal Network. This makes it ideal for preliminary analyses or when a quick estimation is required. It runs significantly faster than 3D models, allowing for quicker iterations and more efficient decision-making.

Sigrity 2024.1

Layout Workbench
- Improved Graphical User Interface: A new option, Use Improved User Interface, has been added in the Themes page of the Options dialog box in the Layout Workbench GUI. In the new GUI, the toolbar icons and menu options have been enhanced and rearranged.
Broadband SPICE
- Python Script Integration with Command Line for Simulation Tasks: Broadband SPICE lets you run Python scripts directly from the command line for performing simulation and analysis. The new -py and *.py options make it easier to integrate Python scripts with the command-line operations. This update streamlines the process of automating and customizing simulations from the command line, which makes your simulation tasks faster and easier.
Celsius PowerDC
- Block Power Assignment (BPA) File Format Support: PowerDC now supports the BPA file format. Similar to the Pin Location (PLOC) file, the BPA file is a current assignment file that defines the total current of a power grid cell, which is then equally distributed across the power pins within the cell. This provides better control over the power distribution.
- Ability to Run Multiple IR Drop Cases Sequentially: You can now select multiple result sinks from the Current-Limited IR Drop flow and run IR Drop analysis for them sequentially. PowerDC automatically runs the simulations in sequence after you select multiple result sinks. This saves time by automating the process.
- Enhanced Support for Mixed Conversion Devices: PowerDC now supports mixing different conversion devices, such as switching regulators and linear regulators within a single DC-DC/LDO instance. This enhancement offers added flexibility by letting you configure each instance in your design according to your specific needs.
PowerSI
- Monte Carlo Method Added: A new option, Monte Carlo Method, has been added in the Optimality dialog box. This option lets you create multiple random samples to depict variations in the input parameters and assess the output.
- Channel Check Optimization Added: The S-Parameter Assessment workflow in PowerSI now supports Channel Check Optimization. It uses the AI-driven Multidisciplinary Analysis and Optimization (MDAO) technology that lets you optimize your design quickly and efficiently with no accuracy loss.
SPEEDEM
- Multi-threaded Matrix Solver Support Added: The Enable Multi-threaded Matrix Solver check box has been added that lets you accelerate the simulation speed for high-performance computing. This check box provides two options, Automatic and Always, to include the -lhpc4 or -lhpc5 parameter, respectively, in the SPEEDEM Simulator (SPDSIM) before running the simulation.
XtractIM
- Options to Skip or Calculate Special DC-R Simulation Results: The Skip DC_R of Each Path and Only DC_R of Each Path options have been added to the Setup menu.
. Skip DC_R of Each Path: This option lets you skip the calculation of the DC-R result during the simulation. Other results, such as SPICE T-model, RL_C of Each Path, Coupling of Each Path, etc., are still calculated.
. Only DC_R of Each Path: This option lets you calculate the DC-R result only during the simulation. Other results, such as SPICE T-model, RL_C of Each Path, Coupling of Each Path, etc., are not calculated.
- Color Assignment for Pin Matching: The MCP Auto Connection window includes the Display Color Editor, which lets you assign a color for pin matching. It helps you easily identify the matching pins in the left and right sections of the MCP Auto Connection window.
- Ability to Save Simulations Individually: The Save each simulation individually check box has been added to the Tools - Options - Edit Options - Simulation (Basic) - General form. Select this check box and run the simulation to generate a simulation results folder containing files and logs with a timestamp for each simulation.
- Reuse of SPD File Settings: The XtractIM setup check box lets you import an existing package setup to reuse the configurations and settings from one .spd file to another.

Documentation Enhancements

Cloud-Based Help System Upgraded
- The cloud-based help system, Doc Assistant, has been upgraded to version 24.10, which contains several new features and enhancements over the previous 2.03 version.
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Cadence Sigrityprovides a rich set of gigabit signal and power network analysis technologies, including a unique power-aware signal integrity analysis capability for system, printed circuit board (PCB), and IC package designs. The combination of Sigrity analysis technologies with Cadence Allegro and OrCAD design tools will provide a comprehensive front-to-back integrated flow to enable system and semiconductor companies to deliver high-performance devices employing gigabit interface protocols such as DDR and PCI Express. The integrated solution will particularly benefit customers delivering electronic systems in high-growth markets such as mobile multimedia devices and cloud computing infrastructure.
Systems Analysisproducts complement Sigrity tools and are focused on complete systems. Thermal, EMI, RF, and extraction simulations include design data beyond ECAD and often include MCAD components such as antennas, cables, connectors and enclosures.

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Cadenceis a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world's most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work.